With the help of modern high vacuum- PVD- equipment we are able to deposit flat and non-flat substrates with metallic, semiconductive or insulative materials in small and midle series production. 
PVD-deposition is especially suitable for: 

• metalize of ceramic, e. g. for conductive lanes and electrical contacts
• metalize of glass, e. g. for  solderable connections
• deposition of foils, e. g. for electrically conductive films

The following deposition methods are available: 

• dc-magnetron-sputtering, e. g. for CrNi, Ni, Mo, W
• rf-magnetron-sputtering, e. g. for SiO₂
• thermal evaporation, e. g. for Au, Ag, Al
• flash-evaporation for chemical compounds and alloys

All substrates can be treated before deposition in situ for surface cleaning with inverse sputtering etching. This pretreatment ensure good sticking properties of the thin films on the substrates.